Exhibitors' Presentation
seminars scene
Many exhibitors will present their latest products and technical information inside the exhibition halls.

FREE Venue: Inside the Exhibition Halls
(no pre-registration necessary.)

[ NOTE ]
You may not be able to attend a seminar when the room reaches its full capacity.
Please note that some seminar may not have interpretation.
※ Please note that programs are subject to change. Jan.16 [Wed]
Automotive Ethernet, with a homogeneous in-vehicle network

REALTEK SEMICONDUCTOR CORP.

IVN could be applied by different communication principles, and support subnetworks connected through gateways.

Date Jan 16 [Wed] 11:00 ~ 12:00
Venue Presentation Venue: East-B
Global examples of forefront agile software development

FPT JAPAN HOLDINGS CO., LTD.

Shortage of engineers is a big problem. FPT and KDDI will explain by using examples of agile and offshore development.

Date Jan 16 [Wed] 11:00 ~ 12:00
Venue Presentation Venue: East-C
SmartSurface - IMSE Injection Molded Structural Electronics

TACTOTEK

IMSE(TM) integrates and encapsulate printed electronics and standard components within 3D injection-molded plastics.

Date Jan 16 [Wed] 11:00 ~ 12:00
Venue Presentation Venue:East-D
Aluminum Strip for Automotive Application

K.BRASCH & CO., LTD.

Process for different qualities: homogenizing/re-heating via solution heat treatment and quenching to aging, hot forming

Date Jan 16 [Wed] 11:00 ~ 12:00
Venue Presentation Venue:East-E
Holistic solution for Integrated cockpit and autonomous car

QNX SOFTWARE SYSTEMS K.K.

Foundation provided by BlackBerry and QNX for domain controller, hypervisor, functional safety and security

Date Jan 16 [Wed] 12:20 ~ 13:20
Venue Presentation Venue:East-D
The Holistic HMI approach

SOCIONEXT EMBEDDED SOFTWARE AUSTRIA GMBH

Holistic HMIs are able to connect with nomadic devices and consider both the drivers situation and its environment.

Date Jan 16 [Wed] 13:40 ~ 14:40
Venue Presentation Venue: East-B
BorgWarner Propulsion Solutions Portfolio

BORGWARNER

Propulsion System Leader for Combustion, Hybrid and Electric Vehicles. Solutions for a clean, energy-efficient world

Date Jan 16 [Wed] 13:40 ~ 14:40
Venue Presentation Venue: East-C
SGS explans VDA6.3 standard with introducting practices

SGS JAPAN INC.

VDA6.3 process audit demand is increased by German automakers. SGS explains VDA6.3 standard with introducting practices.

Date Jan 16 [Wed] 13:40 ~ 14:40
Venue Presentation Venue:East-D
Image Recognition Software for Autonomous Vehicle

NEC SOLUTION INNOVATORS CO., LTD.

Introduce our strategy of in-vehicle software, and image recognition software to detect objects around the vehicle.

Date Jan 16 [Wed] 13:40 ~ 14:40
Venue Presentation Venue:East-E
AD Platform - Decisions and Optimizations

QUANTA COMPUTER INC.

Platform optimization for high performance computing, sensor fusion, deep learning, safety and legacy vehicle tasks.

Date Jan 16 [Wed] 15:00 ~ 16:00
Venue Presentation Venue: East-C
OTSL's approach to autonomous driving technology

OTSL INC.

We introduce real-time sensor simulator, and the work related to autonomous driving technology and development process.

Date Jan 16 [Wed] 15:00 ~ 16:00
Venue Presentation Venue:East-B
Go for a non stop production program

SYNTHE TECH INC.

Cutting Chip cover and APS Quick Jaw by every chucking increase production time.

Date Jan 16 [Wed] 15:00 ~ 16:00
Venue Presentation Venue:East-D
Driving 11B Miles in the Cloud: Autonomous Driving on Azure

MICROSOFT JAPAN CO., LTD.

Across data ingest, sensor validation, training & simulation, a demo-intensive description, powered by Azure.

Date Jan 16 [Wed] 15:00 ~ 16:00
Venue Presentation Venue:East-E
AI Computing Platform for Autonomous Driving

HORIZON ROBOTICS

Horizon Robotics,global leader of edge AI platform provider,offers perception turn-key solutions for automotive industry

Date Jan 16 [Wed] 16:20 ~ 17:20
Venue Presentation Venue: East-B
SiC MOSFET to Improve Efficiency of Automotive Drive Circuit

STMICROELECTRONICS

ST SiC MOSFET is ideal for EV/HEV power circuits. The seesion is to talk on gate driving examples and switching behavior

Date Jan 16 [Wed] 16:20 ~ 17:20
Venue Presentation Venue:East-C
※ Please note that programs are subject to change. Jan.17 [Thu]
3D Depth Sensing for Enhanced ADAS

ETRON TECHNOLOGY INC.

High speed data transport technology from Etron/eYs3D/eEver would enable your next generation ADAS.

Date Jan 17 [Thur] 11:00 ~ 12:00
Venue Presentation Venue: East-B
Optimizing In-Vehicle Connectivity

VALENS

The proliferation of devices & features within our cars demands an optimized in-vehicle connectivity technology -HDBaseT

Date Jan 17 [Thur] 11:00 ~ 12:00
Venue Presentation Venue: East-C
Maturity of Automobiles LiDARs

CEPTON TECHNOLOGIES INC.

A mature automobile LiDARs become a main stream sensor for automobile active safety and the ultimate autonomy.

Date Jan 17 [Thur] 11:00 ~ 12:00
Venue Presentation Venue: East-D
Furnace Technology for Automotive Application

K.BRASCH & CO., LTD.

Right furnace for customers (RHF/MLF), Safety system, Advanced centering system, Tailor Tempering technology

Date Jan 17 [Thur] 11:00 ~ 12:00
Venue Presentation Venue:East-E
Current magnesium structural components for automobiles

MERIDIAN LIGHTWEIGHT TECHNOLOGIES INC.

Introduction of recent large magnesium structural components for automobiles by Meridian Lightweight Technologies Inc.

Date Jan 17 [Thur] 12:20 ~ 13:20
Venue Presentation Venue: East-D
Trends of Automotive Software Platform & Activities of APTJ

APTJ CO., LTD.

We explain the trend of automotive software platform focusing on AUTOSAR & the outline of Julinar SPF developed by APTJ.

Date Jan 17 [Thur] 12:20 ~ 13:20
Venue Presentation Venue:East-C
Israel Innovation Seminar: 3D Imaging sensor, multi-antenna Radar-on-a-Chip

VAYYAR IMAGING LTD.

48 antennas, at 77-81Ghz, allows in-cabin monitoring & 360 coverage for parking, blind-spot detection, navigation & ADAS

Date Jan 17 [Thur] 12:35 ~ 12:55
Venue Presentation Venue: East-F
Israel Innovation Seminar: Front-end automotive DSP voice and audio technologies

ALANGO LTD.

Solutions for automotive hands-free, speech recognition improvement, audio enhancement and In-Car communication

Date Jan 17 [Thur] 12:55 ~ 13:15
Venue Presentation Venue: East-F
Israel Innovation Seminar: Know the hacker-a critical step in automotive cyber security

ARGUS CYBER SECURITY LTD.

Effective automotive cyber security begins with understanding who will target your vehicles and why

Date Jan 17 [Thur] 13:15 ~ 13:35
Venue Presentation Venue: East-F
Israel Innovation Seminar: Computer Vision In Cabin Sensing Solutions / On the Path to Full Autonomy

EYESIGHT TECHNOLOGIES LTD.

A look into in-cabin sensing from current safety applications to level 3 hand-off, and the cabin experience in level 5.

Date Jan 17 [Thur] 13:35 ~ 13:55
Venue Presentation Venue: East-F
Latest Regulations of EV in Chinese Market

TUV RHEINLAND JAPAN LTD.

We explain latest regulations of EV in Chinese market, subsidy system, and new Chinese voluntary certification system.

Date Jan 17 [Thur] 13:40 ~ 14:40
Venue Presentation Venue:East-C
Original engineering plastics for lightweight and quality 

UNITIKA LTD.

Introducing unique resins such as biomass-derived nylon with excellent sliding and high temperature characteristics.

Date Jan 17 [Thur] 13:40 ~ 14:40
Venue Presentation Venue:East-D
Microsoft AI technology for Realtime Driver Monitoring

MICROSOFT JAPAN CO., LTD.

End-to-end solution powered by Microsoft AI - face id, emotion API & computer vision, to bots, text analytics & Bing.

Date Jan 17 [Thur] 13:40 ~ 14:40
Venue Presentation Venue:East-E
Israel Innovation Seminar: Optimizing In-Vehicle Connectivity

VALENS

The proliferation of devices and features within our cars demands an optimized in-vehicle connectivity technology.

Date Jan 17 [Thur] 13:55 ~ 14:15
Venue Presentation Venue: East-F
Israel Innovation Seminar: Robust obstacle detection in any weather/lighting conditions

FORESIGHT AUTOMOTIVE LTD.

Performance evaluation of different autonomous driving sensors in severe weather (fog, rain, snow, dust and glare)

Date Jan 17 [Thur] 14:15 ~ 14:35
Venue Presentation Venue: East-F
Israel Innovation Seminar: Introduction to Hailo specialized deep learning processor

HAILO

Hailo's novel processor technology for deep learning applications to deliver data center performance to edge devices.

Date Jan 17 [Thur] 14:35 ~ 14:55
Venue Presentation Venue: East-F
Israel Innovation Seminar: Use of car profiling for early detection & accurate IDPS

ENIGMATOS LTD.

Enigmatos extracts a unique digital profile for each vehicle to foster early detection and accurate cyber protection

Date Jan 17 [Thur] 14:55 ~ 15:15
Venue Presentation Venue: East-F
Introduction of IATF 16949, Organisation Resilience and BSOL

BSI GROUP

1.IATF 16949 & Organizational Resilience
2.ISO 45001
3.BSOL

Date Jan 17 [Thur] 15:00 ~ 16:00
Venue Presentation Venue: East-C
SGS explans VDA6.3 standard with introducting practices

SGS JAPAN INC.

VDA6.3 process audit demand is increased by German automakers. SGS explains VDA6.3 standard with introducting practices.

Date Jan 17 [Thur] 15:00 ~ 16:00
Venue Presentation Venue:East-D
Israel Innovation Seminar: In-Cabin Monitoring With Computer Vision

JUNGO CONNECTIVITY LTD.

Jungo provides driver & in-cabin monitoring solutions to dozens of partners & customers in the Japanese automotive space

Date Jan 17 [Thur] 15:15 ~ 15:35
Venue Presentation Venue: East-F
Israel Innovation Seminar: Optimizing Pooling, Electrification & AVs with AI Deep-RL

AIGENT-TECH LTD.

long-term expected reward processes and AI deep-RL algorithms to optimize pooling, electrification and AV fleets.

Date Jan 17 [Thur] 15:35 ~ 15:55
Venue Presentation Venue: East-F
Israel Innovation Seminar: Cyber Defense for Sensors

REGULUS CYBER

From GNSS to LiDAR and Radar - Regulus protects critical sensors from spoofing and jamming attacks on their system.

Date Jan 17 [Thur] 15:55 ~ 16:15
Venue Presentation Venue: East-F
Israel Innovation Seminar: Silentium Quite Bubble - Unwanted Sound Management

SILENTIUM LTD.

Silentium broadband ANC technology which simultaneously reduce low frequency noises up to 1 kHz.

Date Jan 17 [Thur] 16:15 ~ 16:35
Venue Presentation Venue: East-F
OTSL's approach to autonomous driving technology

OTSL INC.

We introduce real-time sensor simulator, and the work related to autonomous driving technology and development process.

Date Jan 17 [Thur] 16:20 ~ 17:20
Venue Presentation Venue:East-B
Approaching future automotive landscape with ST sensor offer

STMICROELECTRONICS

ST leverages MEMS know-how coming from the consumer experience to offer smart approach for fresh automotive applications

Date Jan 17 [Thur] 16:20 ~ 17:20
Venue Presentation Venue:East-C
Israel Innovation Seminar: Intro to TADITEL and HD LIN Voltage regulator

TADITEL AUTOMOTIVE ELECTRONICS LTD.

Taditel Develops and manufactures Voltage Regulator for the OE, The voltage Reg has a programmed ASIC design by Taditel


Date Jan 17 [Thur] 16:35 ~ 16:55
Venue Presentation Venue: East-F
Israel Innovation Seminar: TriEye revolutionary SWIR technology

TRIEYE

TriEye's solution allows superior sight under any condition, improving safety and enabling the autonomous car revolution

Date Jan 17 [Thur] 16:55 ~ 17:15
Venue Presentation Venue: East-F
Israel Innovation Seminar: Securing the Connected Car from the Cloud

UPSTREAM SECURITY

How to secure the connected car and the automotive cloud in the era of the dynamic smart mobility ecosystem

Date Jan 17 [Thur] 17:15 ~ 17:35
Venue Presentation Venue: East-F
※ Please note that programs are subject to change. Jan.18 [Fri]
The Challenge of Memory in Future Automotive World

WINBOND ELECTRONICS CORP.

Winbond will deliver experience and successful story in Flash, DRAM, Security elements to be the value partner.

Date Jan 18 [Fri] 11:00 ~ 12:00
Venue Presentation Venue: East-B
coming soon
Date Jan 18 [Fri] 11:00 ~ 12:00
Venue Presentation Venue:East-C
The Latest Trend of Lightweighting Technology

GSI CREOS CORPORATION

1. HRC(China): The first composite R&D center in Asia.
2. KraussMaffei(Germany): The latest trend of molding technology.

Date Jan 18 [Fri] 11:00 ~ 12:00
Venue Presentation Venue:East-D
Introduce verious kinds of 3D printed jigs we made.
Date Jan 18 [Fri] 11:00 ~ 12:00
Venue Presentation Venue:East-E
New Soldering Approach for the Era of EV & ADAS

SENJU METAL INDUSTRY CO., LTD.

Soldering Approach for Era of EV & ADAS will be presented by Masato Shimamura, Senior Mgr. of Solder Technical Center.

Date Jan 18 [Fri] 12:20 ~ 13:20
Venue Presentation Venue:East-B
Magnetic fluid and High-Precision Direct-Current Sensors

FERROTEC CORP.

Developed device with Hzero for direct-current measurement featuring an extremely high accuracy near the zero point.

Date Jan 18 [Fri] 12:20 ~ 13:20
Venue Presentation Venue:East-C
Features and applications of low-energy electron beam.

HAMAMATSU PHOTONICS K.K.

Low-energy electron beam irradiation is lightweight and improve functionality of rubber, plastic parts and coating.

Date Jan 18 [Fri] 12:20 ~ 13:20
Venue Presentation Venue:East-D
OBD Sensor-fusion Technology of NIRA Dynamics

NIRA DYNAMICS AB

Indirect TPMS and RSI - the road-friction cloud service applied with sensor-fusion technology from NIRA Dynamics.

Date Jan 18 [Fri] 12:20 ~ 13:20
Venue Presentation Venue:East-E
Testing, evaluation and analysis for car electronics

JFE TECHNO-RESEARCH CORPORATION

We introduce actual examples of analysis and CAE of durability and reliability for car electronics.

Date Jan 18 [Fri] 13:40 ~ 14:40
Venue Presentation Venue:East-B
Outline of certification services for automotive industry

JAPAN QUALITY ASSURANCE ORGANIZATION

Introduction of new services for automotive industry

Date Jan 18 [Fri] 13:40 ~ 14:40
Venue Presentation Venue:East-C
SGS explans VDA6.3 standard with introducting practices

SGS JAPAN INC.

VDA6.3 process audit demand is increased by German automakers. SGS explains VDA6.3 standard with introducting practices.

Date Jan 18 [Fri] 13:40 ~ 14:40
Venue Presentation Venue:East-D
Car Electronics Measurement by High Accuracy Current Sensor

HIOKI E.E.CORPORATION

Electrical power analyzing of PWM or switching power unit. Describe power analyzer & Current sensors with actual cases.

Date Jan 18 [Fri] 15:00 ~ 16:00
Venue Presentation Venue:East-B
Strength of TLC 3D NAND Products in Next Generation Vehicles

WESTERN DIGITAL JAPAN LTD.

Will discuss what the characteristics and strengths are that make TLC 3D NAND a great technology.

Date Jan 18 [Fri] 15:00 ~ 16:00
Venue Presentation Venue:East-C
Latest information of WPT,5G,OTA for automotive testing.

VITEC GLOBAL ELECTRONICS CO., LTD.

Wireless power supply (WPT) in automotive, 5G, OTA measurement latest trend introduction.

Date Jan 18 [Fri] 15:00 ~ 16:00
Venue Presentation Venue:East-D
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