Exhibitors' Presentation
seminars scene
Many exhibitors will present their latest products and technical information inside the exhibition halls.

FREE Venue: Inside the Exhibition Halls
(no pre-registration necessary.)

[ NOTE ]
You may not be able to attend a seminar when the room reaches its full capacity.
Please note that some seminar may not have interpretation.
※ Please note that programs are subject to change. Jan.16 [Wed]
Latest status of SiC, Silicon semiconductor wafer processing

ROKKO ELECTRONICS CO., LTD.

Introduce the latest situaion of new material wafer of SiC, Sapphire, Lithium Tantare, as well as Silicon wafer.

Date Jan 16 [Wed] 12:20 ~ 13:20
Venue Presentation Venue:East-A
Low thermal resistance MCPCB and sintering paste

MITSUBISHI MATERIALS CORP.

From our bonding technology, low thermal resistance MCPCB and sintering paste are shown.

Date Jan 16 [Wed] 13:40 ~ 14:40
Venue Presentation Venue:East-A
※ Please note that programs are subject to change. Jan.17 [Thu]
Inline nondestructive inspection tech of substrate solder.
Date Jan 17 [Thur] 11:00 ~ 12:00
Venue Presentation Venue:East-A
High-performance thermosetting / UV curable resins

NIPPOKAYAKU CO., LTD.

High-performance thermosetting / UV curable resins with heat resistance, high adhesion, low shrinkage and low dielectric

Date Jan 17 [Thur] 12:20 ~ 13:20
Venue Presentation Venue:East-B
REAL ZERO SOLDERIMG ROBOTS

PARAT CO., LTD.

1.RZ-SINGLE--1point soldering robots
2.RZ-MULTI--2-10point soldering robots

Date Jan 17 [Thur] 13:40 ~ 14:40
Venue Presentation Venue:East-A
Telelumen's Light Replicator and human centric lighting

KLV CO., LTD.

To introduce 1) concept of human centric lighting and 2) examples of how Light Replicator contributes to the concept.

Date Jan 17 [Thur] 13:40 ~ 14:40
Venue Presentation Venue:East-B
Example of PCB layout design and simulation of DDR4,LPDDR4
Date Jan 17 [Thur] 15:00 ~ 16:00
Venue Presentation Venue:East-A
Powder processing technologies for functional fine particles
Date Jan 17 [Thur] 15:00 ~ 16:00
Venue Presentation Venue:East-B
※ Please note that programs are subject to change. Jan.18 [Fri]
The technology "Full inspection of Automotive products."
Date Jan 18 [Fri] 11:00 ~ 12:00
Venue Presentation Venue:East-A
Dispense Technologies for Smartphones, Automobile and IoT

MUSASHI ENGINEERING, INC.

Latest dispense technologies for solder paste jetting, dispensing of thermal grease/moisture proof materials/grease

Date Jan 18 [Fri] 13:40 ~ 14:40
Venue Presentation Venue:East-A
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