JAPANESE
Booth No.: E50-14
Taiwan Connected Automated Vehicle Innovation Forum
Exhibitor Overview
SIPO started to help semiconductor companies stepping into IoT and AI applications in 2018, and to promote industrial transformation and upgrading.
Exhibited Products / Technologies (Manufacturer)
Realtek Semiconductor Corp. - Ethernet Era for Car
Automation and connectivity are driving the automotive industry forward, and in answer to the growing need for bandwidth, flexibility, and cost-effectiveness, in-car networks are evolving. Ethernet is emerging as a preferred choice.With the Automotive Ethernet solution offered by Realtek, all those design challenges in vehicle networking will be answered.

Etron - 3D Depthmap for Enhanced ADAS
Etron Technology, Inc. is a world-class fabless IC design and product company, specializing in buffer memory and system-on-chips. The complete product line has been used widely in various emerging areas, including broadband networking, IoT, display panels, automotive and robotics, announcing that the company has stepped into a new era of intelligence.

Winbond - DRAM & FLASH
Winbond Electronics is a leading supplier of DRAM and FLASH products. Even in automotive electronics, which expands rapidly nowadays, our company's memory is widely used. In this demonstration, we will introduce the memory products that can contribute to future automotive fields such as memory that can transfer data at higher speed, technology that realizes higher security, etc.
 
Exhibitors' Presentation
Date / Time Venue Presentation Title / Abstract
Jan 16 [Wed]
11:00 ~ 12:00
Presentation Venue: East-B REALTEK SEMICONDUCTOR CORP.

Automotive Ethernet, with a homogeneous in-vehicle network
IVN could be applied by different communication principles, and support subnetworks connected through gateways.
Jan 17 [Thur]
11:00 ~ 12:00
Presentation Venue: East-B ETRON TECHNOLOGY INC.

3D Depth Sensing for Enhanced ADAS
High speed data transport technology from Etron/eYs3D/eEver would enable your next generation ADAS.
Jan 18 [Fri]
11:00 ~ 12:00
Presentation Venue: East-B WINBOND ELECTRONICS CORP.

The Challenge of Memory in Future Automotive World
Winbond will deliver experience and successful story in Flash, DRAM, Security elements to be the value partner.
 
Company Information
URL:Exhibitor's Official Website
Department/Division:SIPO - Industrial Technology Research Institute
  
Co-exhibitor
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE  /  ETRON TECHNOLOGY INC.  /  REALTEK SEMICONDUCTOR CORP.  /  WINBOND ELECTRONICS CORP.
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